| SL.No. |
TYPE OF EQUIPMENT |
FUNCTION |
TYPICAL APPLICATION AREAS |
| 1 |
Scanning Electron Microscope (SEM),
conventional or Field Emission; SEM with Energy
Dispersive X-ray Spectrometer (EDS) |
High
magnification Visual Analysis with Good depth
of field, and for Elemental identification with
EDS attachment |
Solder
Joint photo micrographs in reliability failures
and Microcrack visual analysis. Metallization
& Intermetallic sectionals |
| 2 |
Scanning
Acoustic Microscope |
Non-Destructive High Power magnification
|
Underfill voids examination and
analysis, for example in Flip Chips |
| 3 |
Raman
Imaging Microscopes |
Physiochemical analysis of solid
Surfaces, thick and thin solid films |
Identification
of polymers used in electronics packaging |
| 4 |
Fourier
Transform Infra Red Spectrometer (FTIR) |
Identification of molecular species
adsorbed on surfaces. Complementary to Raman
spectro-scopy |
Inorganic
analysis, for example, in tracing near surface
contaminants, etc |
| 5 |
Optical
microscopes |
High
Power visual examination |
Visual analysis of specimens,
typically up to 500 times magnification (Higher
magnification usually limited by resolution) |
| 6 |
High
speed video camera |
Motion
capture & analysis |
Process studies for example in
Flip Chip underfill propagation |
| 7 |
X-ray
Diffractometer |
Sub-Micron thickness measurement |
Nickel or Gold thin film thickness,
for example, on PCBs or Wafers |
| 8 |
X-
Ray Inspection Machine with Computer Tomography |
Non-destructive 3-D imaging of
plastic or thin metallic components |
Solder
joint defects such as voids, opens or shorts
for example in BGAs |
| 9 |
Atomic
Force Microscope (AFM) |
Measurement of nanometer film
thickness; surface topographical mapping, roughness
measurement and section profiling |
Organic
Solder Protectants (OSP) layer coatings on Printed
Circuit Boards and metalization thickness on
Wafers |
| 10 |
Universal Tensile Testing machines
with Environmental Chamber |
Force
Vector Measurements under controlled conditions |
Lead pull Testing,Wire Bond Integrity
in ICs and Chip-On-Board (COB) and in Solder
joint strength characterization |
| 11 |
Nano-hardness tester |
Hardness
measurements of thin film and micro features;
determination of critical load and nano-friction |
Determination
of Critical breaking load stress on substrates,
for example in Flip Chip Under-Bump-Metalization
(UBM); Gold and Silver Thin film deposits on
Silicon dies or PCBs for wire bonding in ICs
or Chip-on-board applications |
| 12 |
Ultra-mirco-hardness tester |
| 13 |
Micro-hardness tester |
| 14 |
Surface contact angle goniometer |
Solder fillet angle measurement |
Wettability testing on PCBs and
on components |
| 15 |
Differential Scanning Calorimeter
(DSC) |
Thermal
and mechanical characterization of polymers |
Glass
Transition temperature (Tg) of PCB and packaging
materials and for Organic Solder Protectants
(OSPs); evaluation of mechanical properties
of polymeric packaging materials, for example,
elastic properties and relaxation behavior of
PCB substrate and Integrated Circuit packaging
materials |
| 16 |
Thermal Mechanical Analyzer (TMA) |
| 17 |
Dynamic Mechanical Thermal Analyzer
(DTMA) |
| 18 |
Simultaneous
thermal analyzer |
Temperature and oxidation stability
of materials; identifications of certain types
of compounds |
Thermal
stability evaluation of Integrated circuit packaging
materials |
| 19 |
Capillary
and Rotational Rheometers |
Rheology
of Polymers |
Characterization of underfill
materials, epoxies, sealants, encapsulants etc. |
