Waterfall Technologies : Articles Published

TITLE	COVERAGE	Journal
Metallization Options for optimum Chip-on-Board Assembly February 2010 Global SMT & Packaging	Metallurgical interactions with die pad and substrate metallizations and how the resulting intermetallic structures and growth impact reliability & cost.
Process challenges and solutions for embedding chip-On-Board into mainstream SMT Assembly January 2010 Global SMT & Packaging	Key considerations, major critical factors and the challenges for a successful COB-SMT merge
Bringing it all together at UIC’s grand opening at Shekou, China	A first hand account of Universal Instrument Corp.’s (UIC, www.uic.com) grand opening of their Shekou, China, facility.	Circuits Assembly June 2003
Asia upswings with MEMS R&D and Microsystems Assembly	How Asian Consortiums are responding to the challenges of MEMS & Microsystems Packaging Technologies	Circuits Assembly March 2003
Going Mainstream with Chip-on-Board	Successfully merging COB with surface mount requires controlling a new set of complex variables related to the wire bonding process.	Circuits Assembly January 2002
An Uncommon Perspective of Surface-Mount Assembly	A behind-the-scenes tour of Printer manufacturing & some of latest innovations	Circuits Assembly April 2001
Asia Forges ahead with Lead-Free Research and Array CSPs	Update on CSP moves & Lead free initiatives	Circuits Assembly Dec 2000
Grappling with Emerging Technologies	BGA Control; Wafer Bumping Services	Circuits Assembly Sep - Oct 99
The Skill of Process Refinement	Process control & Refining thermal profiling	Circuits Assembly Jul - Aug 99
SCI Manufacturing offers Novel approach	SCI's Turn Key services Symposium launch	Circuits Assembly Jul - Aug 99
Flip Chip Seminar proposes Industry Consortium	Gintic Institute's Flip Chip Consortium launch	Circuits Assembly May - Jun 99
Flip Chip & CSP : The Forefront of Asia's Technology	Flip Chip & CSP developments in Asia	Circuits Assembly May - Jun 99
Bridging the gap from Equipment to training	Speedline Technology's new high-tech facility launch	Circuits Assembly Mar - Apr 99
What's Winning ? An Industry Perspective	Survey results of 28 PCB assembly organizations	Circuits Assembly Mar - Apr 99
Process Challenges for Asian Manufacturers : Looking for an edge	Process PPMs & Paste Printing Audit Checklist	Circuits Assembly Jan - Feb 99
Team based Design Software	OrCad's Release 9 PCB design Software unveiled	Jan - Feb 99
The Fine Art of the Analytical Laboratory	Modern Analytical Equipment applications charted	Circuits Assembly Nov - Dec 98
Strategic Equipment Planning	Improving Equipment acquisition process	Circuits Assembly Sep - Oct 98
Making the connection	Connectors roadmap, advancements & materials	Circuits Assembly Jul - Aug 98
Promosol Expands into Asia	No clean moves forward under the UNEP	Circuits Assembly Jul - Aug 98
Asia in Transition	Next generation paste printing, RheoPump™	Circuits Assembly May - Jun 98
The Year of the Tiger : Asia's Economic "El-Nino"	Economic update; Reflow Oven advancements	Circuits Assembly Mar - Apr 98
Asia Pacific Economic Status	Asian crisis; Adhesive printing breakthroughs	Circuits Assembly Jan - Feb 98
Asia Pacific : The New Launching Pad for Surface Mount Technologies	Paste printing innovations-DEKs ProFlow™	Circuits Assembly Nov - Dec 97
The Evolution in Power Surface Mount Technology	Newer Power Package arrive-assembly & heatsinking	Circuits Assembly Sep - Oct 97