5mm x 5mm (glass or silicon chips)
Eutectic solder, gold or electroless-nickel bumps
200 or 250 (µm pitch, available on standard tooling as well as customised design)
Full array or perimeter bumped chips
Laminate (FR4, BT or Teflon materials)
Ceramic
Line/Space: 4/4, 3/3 mil or 2/2 mil, solder mask opening 5 mil
Various types of flip-chip assembly on glass; ceramic; flex or organic substrates
Flip-chip assembly & process development
X-section; SEM; C-SAM and X-ray inspection
Thermal cycling, SIR, failure analysis
Mechanical tests, die shear & pull, fatigue and creep
Thermal characterisation
Device Name
Die
Delivery
304
200
95
232
250
88
64
608
100
20
176
A : Available Delivery : 1 to 12 weeks depending on availability Customised requirements : Leadtime dependent on design
1-18
EN/IG : Electroless nickel/immersion gold Delivery : Please enquire Customised requirements : Leadtime dependent on design