Logo Waterfall Technologies Unlock the Potential of the Latest Surface Mount Technology
 Home
 Flip Chip Evaluation Kits
 Client List
 Registration
 Articles Published
 Analytical Lab Services
 SMT Workshops
 Computer Based
 In-house Workshops
 Public Programs
 Contact Us
FLIP CHIP EVALUATION KITS


  Daisy Chain Flip-Chip
  • 5mm x 5mm (glass or silicon chips)

  • Eutectic solder, gold or electroless-nickel bumps

  • 200 or 250 (µm pitch, available on standard tooling as well
    as customised design)

  • Full array or perimeter bumped chips

 

Test Board
  • Laminate (FR4, BT or Teflon materials)

  • Ceramic

  • Line/Space: 4/4, 3/3 mil or 2/2 mil, solder mask opening 5 mil

 


Design
  • Customised test chip & test vehicle design and fabrication
Prototyping
  • Various types of flip-chip assembly on glass; ceramic;
    flex or organic substrates

  • Flip-chip assembly & process development

Reliability Testing & Failure Analysis
  • X-section; SEM; C-SAM and X-ray inspection

  • Thermal cycling, SIR, failure analysis

  • Mechanical tests, die shear & pull, fatigue and creep

  • Thermal characterisation

 


ES-A200 Daisy chain, eutectic solder bumped, array 200µm test die
ES-A250 Daisy chain, eutectic solder bumped, array 250µm test die
ES-P200 Daisy chain, eutectic solder bumped, peripheral 200µm test die
ES-P250 Daisy chain, eutectic solder bumped, peripheral 250µm test die
G-A100 Daisy chain, gold bumped, array 100µm test die
G-P100 Daisy chain, gold bumped, peripheral 100µm test die
EN-A100 Daisy chain, electroless nickel/immersion gold bumped, array 100µm test die
EN-P100 Daisy chain, electroless nickel/immersion gold bumped, peripheral 100µm test die

Device Name

         

Die

       

Delivery

  Size (mm) I/O Bump Allays Pitch (µm) Height (µm) Pattern Passivation Daisy Chain Tray (inch)
BCB Si=N
ES-A200 5x5

304

Sn/Pb

200

95

Array A A Yes 2x2
ES-A250 5x5

232

Sn/Pb

250

95

Array A A Yes 2x2
ES-P200 5x5

88

Sn/Pb

200

95

Peripheral A A Yes 2x2
ES-P250 5x5

64

Sn/Pb

250

95

Peripheral A A Yes 2x2
G-A100 5x5

608

Au

100

20

Array A A Yes 2x2
G-P100 5x5

176

Au

100

20

Peripheral A A Yes 2x2
EN-A100 5x5

608

EN/IG

100

20

Array A A Yes 2x2
EN-P100 5x5

176

EN/IG

100

20

Peripheral A A Yes 2x2

 

A : Available
Delivery : 1 to 12 weeks depending on availability
Customised requirements : Leadtime dependent on design

Substrate Type Laminate
(BT, High Tg FR4, FR4)
Teflon Ceramic/Glass
Substrate thickness (mm) 0.3-1.6 0.3-1.6 0.4-1.0
Substrate size (mm) 100x100 (typical) 100x100 (typical) 100x100 (typical)
Conductor thickness (µm) 9,12,18,36 18,36

1-18

Minimum line/space (µm) 75/75 75/75 50/50
Finishing EN/IG EN/IG EN/IG
Soldermask 20-30µm 20-30µm ---
No. of bond sites per substrate 12 (typical) 12 (typical) 12 (typical)
Assembly ES-A200, A250, P200, P250 ES-A200, A250, P200, P250 G-A100, P100, EN-A100, P100

EN/IG : Electroless nickel/immersion gold
Delivery : Please enquire
Customised requirements : Leadtime dependent on design