WS2
- 14 April 2015. 8:30 A.M. - 12:00 P.M. Duration: 1/2 day 3.5 Hours
"VITAL TECHNOLOGY TRENDS IMPACTING
SMT ASSEMBLY- WHAT YOU NEED TO KNOW TODAY TO SURVIVE TOMORROW"
WS4- 14 April 2015. 1:30 A.M. - 5:00 P.M. Duration: 1/2 day 3.5 Hours
"PROCESS DEVELOPMENT &
YIELD ENHANCEMENT INVOLVING ADVANCED PACKAGES"
WS2-COVERAGEDownload
WS2 Workshop Brochure with Detailed Topics Listing
This program focuses on key priorities and trends based on real-life needs
expressed by attendees. Leading edge assembly areas cover 01005 process
challenges, Plasma Etching & Cleaning Applications and Conformal Coatings
- practices, materials, equipment and processes. Emerging reliability
threats address areas such as Tin Whiskers, Creep Corrosion, PCB Pad Cratering-
what it is, how to recognize it, impact and mitigation practices. Lastly
it examines the futuristic field of Embedded Passives. WS4-COVERAGE Download
WS4 Workshop Brochure with Detailed Topics Listing This workshop provides a focused coverage of techniques,
materials and processes involved in state-of-the-art SMT assembly. It
provides participants knowledge on the significant interactive variables
impact involving current, advanced packages and ultra-miniature components
assembly. It provides an understanding of approaches and techniques to
address defects, process issues and improve yields. Practical, real life,
examples are used to illustrate and to augment the learning during this
program. Registration: http://www.smta.org/southeast-asia/