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WS2 - 14 April 2015. 8:30 A.M. - 12:00 P.M. Duration: 1/2 day 3.5 Hours
"VITAL TECHNOLOGY TRENDS IMPACTING SMT ASSEMBLY- WHAT YOU NEED TO KNOW TODAY TO SURVIVE TOMORROW"

WS4- 14 April 2015. 1:30 A.M. - 5:00 P.M. Duration: 1/2 day 3.5 Hours
"PROCESS DEVELOPMENT & YIELD ENHANCEMENT INVOLVING ADVANCED PACKAGES"

WS2-COVERAGE Download WS2 Workshop Brochure with Detailed Topics Listing
This program focuses on key priorities and trends based on real-life needs expressed by attendees. Leading edge assembly areas cover 01005 process challenges, Plasma Etching & Cleaning Applications and Conformal Coatings - practices, materials, equipment and processes. Emerging reliability threats address areas such as Tin Whiskers, Creep Corrosion, PCB Pad Cratering- what it is, how to recognize it, impact and mitigation practices. Lastly it examines the futuristic field of Embedded Passives.

WS4-COVERAGE
Download WS4 Workshop Brochure with Detailed Topics Listing
This workshop provides a focused coverage of techniques, materials and processes involved in state-of-the-art SMT assembly. It provides participants knowledge on the significant interactive variables impact involving current, advanced packages and ultra-miniature components assembly. It provides an understanding of approaches and techniques to address defects, process issues and improve yields. Practical, real life, examples are used to illustrate and to augment the learning during this program.

Registration: http://www.smta.org/southeast-asia/

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March 2015