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Completed: Friday, 9 April 2010 2:00 PM - 5:00 PM

Process Challenges and Metallization Options for
Embedding Chip-on-Board into Mainstream SMT

Instructor: Mukul Luthra, Waterfall Technologies, Canada
Here's how the Apex attendees rated this program
on a scale of 1 to 6

Course Content : 5.8
Instructor Delivery : 6.0

Compare this to Average of ALL Workshops :
Course Content : 5.0
Instructor Delivery : 5.2 

Comments:
Improvements -
Lots of material to be covered in 3 hours - 4 hours would be better

Likes -

Very good technical details contained in slide for
multiple process alternatives. (not just one technique)
The cross appplication information between SMT COB and Wire bonding
Instructors depth of knowledge
Presentation Material
Analyical approaches of COB and SMT to failure analysis, 
M etallurgy and material science and the importance of applying
all of these to move forward in continuous methodology improvements.

Additional:
Great course!!
Proper course material explained clearly 
and fundamentally accurate!
Great course materials.


http://www.youtube.com/watch?v=N8wumEtp8Hk

This course examines Chip-on-Board (COB) technology, using real-life
examples to summarize key considerations, critical factors and
challenges of a successful COB-SMT merge. Driving factors and
where COB is positioned vis-à-vis other approaches toward a higher
level of integration, the selection criteria and considerations for bare dies,
their quality and acquisition, and applicable standards are also covered.

What you will learn:

Fundamentals of the COB process, the approach that cuts costs, and
significantly improves footprint efficiency and lead time Design rules for
fan out, pitches, layout, attachment considerations, bonding variables, bonding tools and tool variables, inspection and challenges in failure analysis and rework Optional flows for embedding COB along with SMT assembly on a common platform Metallization- conflicting requirements for bonding versus soldering

Agenda:

Module 1 - Introduction
Applications & Positioning
Bare Die Considerations and UBD
Design Rules
Pad Design & Layout Examples

Module 2 - COB Process
Bonding Options
Tools & Equipment
Bonding Variables
Metallurgical Systems & Intermetallics
Merging COB in SMT
Process Flow Options - Pro's & Con's
Challenges in Failure Analysis
Pull Testing
Real Life COB Product Examples
COB Assembly line - A pictorial tour

Module 3 – Conclusion Module 3 – Conclusion

Summary of Key Success Factors
References
Future Reading and Information Sources

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