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IDEA Innovations & Developments in Electronics Assembly”

State-of-the-Art Technology Workshops 2015
Download 2015 Training brochure with Full details and Topics

WORKSHOP 1
3D PRINTED ELECTRONICS, NANO COATINGS AND VITAL TECHNOLOGY TRENDS IMPACTING ELECTRONICS ASSEMBLY – ENVISION THE FUTURE FOR SUCCESS
1 1/2 Day
 WORKSHOP 2
PROCESS DEVELOPMENT AND YIELD ENHANCEMENT INVOLVING ADVANCED PACKAGES, 01005 and PoP ASSEMBLY
2 Days
WORKSHOP 3 ABASIC SMT: FUNDAMENTALS OF SMT PROCESSES
1 Day[

WORKSHOP 4
SSMT FOR THE PACKAGING, BACKEND & PCB PROFESSIONALS
2 Days
WORKSHOP 5 BBGAs & CSPs: SOLUTION ORIENTED SMT MANUFACTURING TECHNIQUES FOR ENHANCED ASSEMBLY & YIELD
2 Days
WORKSHOP 6 L BRIDGING THE GAP FROM CHIP TO BOARD – LEVERAGING
COB TECHNOLOGY IN SMT & PACKAGING APPLICATIONS
1 Day
WORKSHOP 7 IMIMPLEMENTING FLIP CHIP ASSEMBLY IN MAINSTREAM SMT & PACKAGING APPLICATIONS
1 Day
 WORKSHOP 8 SOLDERING METALLURGY: SCIENCE & PRACTICE IN SMT PROCESSES
1 Day
WORKSHOP 9
 TIN WHISKERS: RISK ASSESSMENT & MITIGATION STRATEGIES
1 Day
IDEA Series of On-Site SMT Training comprises individual workshops addressing critical modern electronic assembly.
Each workshop is independent however modules can be selected from different areas for a customized SMT training package to meet specific needs. A hands-on session can be included in customized programs so classroom training can be applied and proven in practice on the customer's own assembly lines.


Download 2015 Training brochure with Full details and Topics
  • Programs fully customizable to specific needs.
  • Enhanced learning with personal attention
  • Very cost effectiveness on per attendee basis
  • Hands-on session option on customer's own assembly process, equipment & environment
  • Flexibility - Waterfall Technologies can organize the entire event or conduct it client's facility
March 2015