WORKSHOP
1
|
3D
PRINTED ELECTRONICS, NANO COATINGS AND VITAL TECHNOLOGY
TRENDS IMPACTING ELECTRONICS ASSEMBLY – ENVISION
THE FUTURE FOR SUCCESS
|
1
1/2 Day |
WORKSHOP
2
|
PROCESS
DEVELOPMENT AND YIELD ENHANCEMENT INVOLVING ADVANCED
PACKAGES, 01005 and PoP ASSEMBLY |
2 Days
|
WORKSHOP
3 |
ABASIC
SMT: FUNDAMENTALS OF SMT PROCESSES |
1
Day[ |
WORKSHOP 4
|
SSMT
FOR THE PACKAGING, BACKEND & PCB PROFESSIONALS
|
2
Days |
WORKSHOP
5 |
BBGAs
& CSPs: SOLUTION ORIENTED SMT MANUFACTURING
TECHNIQUES FOR ENHANCED ASSEMBLY & YIELD |
2
Days |
WORKSHOP
6 |
L
BRIDGING THE GAP
FROM CHIP TO BOARD – LEVERAGING
COB TECHNOLOGY IN SMT & PACKAGING APPLICATIONS
|
1
Day |
WORKSHOP
7 |
IMIMPLEMENTING
FLIP CHIP ASSEMBLY IN MAINSTREAM SMT & PACKAGING
APPLICATIONS |
1
Day |
WORKSHOP
8 |
SOLDERING METALLURGY:
SCIENCE & PRACTICE IN SMT PROCESSES |
1 Day |
WORKSHOP
9
|
TIN
WHISKERS: RISK ASSESSMENT & MITIGATION STRATEGIES
|
1 Day |