Evolving Technologies In Microelectronics Development [Download the detailed brochure in PDF format] WORKSHOP 1 – BASIC SMT – “FUNDAMENTALS OF SMT PROCESSES”  [ 1 day ] WORKSHOP 2 – ADVANCED SMT – “SMT TECHNOLOGY FOR THE PACKAGING & MODULE MANUFACTURING PROFESSIONALS” [ 2 days ] WORKHOP 3 – APPLIED SOLDERING METALLURGY - “WHAT SMT PROFESSIONALS NEED TO KNOW” [ 1 day ] WORKSHOP 4 – “UNDERSTANDING 3D STRUCTURES, PiP, PoP, FLIP CHIP & CHIP-ON-BOARD ASSEMBLY PROCESSES IN MAINSTREAM SMT” [ 2 days ] WORKSHOP 5 – BALL GRID ARRAYS & CHIP SCALE PACKAGES - “STRUCTURE, ASSEMBLY PROCESS & REWORK”                                [ 2 days ] WORKSHOP 6 – LEAD FREE INTERCONNECTION – “TECHNOLOGY & MANUFACTURING” [ 2 days ] WORKSHOP 7 – TIN WHISKERS – “RISK ASSESSMENT & MITIGATION STRATEGIES” [ 1 day ] [Download the detailed brochure in PDF format]

Our In-house programs comprise a series of training workshops that address critical modern electronic assembly challenges. Each workshop is independent however modules can be selected from different areas for a customized package to meet specific needs. A hands-on session can be included in customized programs so classroom training can be applied and proven in practice on the customer's own assembly lines.

• Enhanced learning with personal attention
• Very cost effectiveness on per attendee basis
• Hands-on session option on customer's own assembly process, equipment & environment
• Programs customizable to specific needs.
• Flexibility - Waterfall Technologies can organize the entire event or customer may opt to do so on their own.