WORKSHOP
1
|
–
THE LATEST & HOTTEST SMT TRENDS: WHAT YOU NEED
TO KNOW TODAY TO SURVIVE TOMORROW |
[1
day] |
WORKSHOP
2
|
–
BASIC SMT: FUNDAMENTALS OF SMT PROCESSES |
[1 day] |
| WORKSHOP
3 |
–
ADVANCED SMT: PROCESS
DEVELOPMENT AND YIELD ENHANCEMENT INVOLVING ADVANCED
PACKAGES, 3-D APPLICATIONS, PiP AND PoP ASSEMBLY |
[2
days] |
WORKSHOP
4
|
–
SMT
FOR THE PACKAGING, BACKEND & PCB PROFESSIONALS
|
[2
days] |
WORKSHOP
5
|
–
PROCESS CHALLENGES & METALIZATION OPTIONS FOR
CHIP-ON-BOARD IN MAINSTREAM SMT AND PACKAGING |
[2
days] |
WORKSHOP
6
|
–
IMPLEMENTING FLIP CHIP ASSEMBLY IN MAINSTREAM SMT
& PACKAGING APPLICATIONS
|
[2
days] |
| WORKSHOP
7 |
–
BGAs & CSPs: STRUCTURE, PROCESS AND REWORK |
[2
days] |
| WORKSHOP
8 |
–
SOLDERING METALLURGY: SCIENCE & PRACTICE IN SMT
PROCESSES |
[1
day] |
WORKSHOP
9
|
–
LEAD FREE SOLDER JOINTS:
CONSIDERATIONS & GUIDELINES FOR IMPROVING YIELD
& RELIABILITY |
[1
day] |
| WORKSHOP
10 |
–
TIN WHISKERS: RISK ASSESSMENT & MITIGATION STRATEGIES
|
[1 day] |