Attendee Comments on: Process Challenges and Metallization Options for Embedding Chip-on-Board into Mainstream SMT
Held Friday, 9 April 2010 2:00 PM - 5:00 PM Las Vegas Instructor: Mukul Luthra, Waterfall Technologies, Canada Here's how the Apex attendees rated this program on a scale of 1 to 6
Course Content : 5.8 Instructor Delivery : 6.0
Compare this to Average of ALL Workshops : Course Content : 5.0 Instructor Delivery : 5.2 Comments: Improvements - Lots of material to be covered in 3 hours - 4 hours would be better Likes - Very good technical details contained in slide for multiple process alternatives. (not just one technique) The cross appplication information between SMT COB and Wire bonding Instructors depth of knowledge Presentation Material Analyical approaches of COB and SMT to failure analysis, Metallurgy and material science and the importance of applying all of these to move forward in continuous methodology improvements. Additional: Great course!! Proper course material explained clearly and fundamentally accurate! Great course materials. http://www.youtube.com/watch?v=N8wumEtp8Hk
This course examines Chip-on-Board (COB) technology, using real-life examples to summarize key considerations, critical factors and challenges of a successful COB-SMT merge. Driving factors and where COB is positioned vis-à-vis other approaches toward a higher level of integration, the selection criteria and considerations for bare dies, their quality and acquisition, and applicable standards are also covered. What you will learn: Fundamentals of the COB process, the approach that cuts costs, and significantly improves footprint efficiency and lead time Design rules for fan out, pitches, layout, attachment considerations, bonding variables, bonding tools and tool variables, inspection and challenges in failure analysis and rework Optional flows for embedding COB along with SMT assembly on a common platform. Metallization- conflicting requirements for bonding versus soldering Agenda: Module 1 - Introduction Applications & Positioning Bare Die Considerations and UBD Design Rules Pad Design & Layout Examples Module 2 - COB Process Bonding Options Tools & Equipment Bonding Variables Metallurgical Systems & Intermetallics Merging COB in SMT Process Flow Options - Pro's & Con's Challenges in Failure Analysis Pull Testing Real Life COB Product Examples COB Assembly line - A pictorial tour Module 3 – Conclusion Module 3 – Conclusion
Summary of Key Success Factors References Future Reading and Information Sources
Bring our Workshops On-site at your Location
